Complete manual with clear schematic diagrams and printed circuit board layouts of two variants of the headset and the transmitter an old and a new version.
Also shows how the headset and the transmitter is opened and how transmitter and receivers can be adjusted and where to measure.
I had no problems to repair the headset using this service manual.
This is a great site. I placed my order and by the next am it was available for download. Had some problems with some missing copy on some pages. Once I brought the error to the OMC's attention, the issue was resolved. I'll come back again.
Text excerpt from page 27 (click to view)
A A B B B A A A A A A B B
- Removing the Case and the Panel Unit
1. Remove eight screws A, seven screws B and two screws C. 2. Remove Case and Panel Units.
B LPF/HPF PCB A LPF/HPF PCB
- Removing the Heat Sink
Some silicone glue has been applied between the Heat Sink and the Heat Sink(Sub). therefore, to remove the Amp Unit from the Heat Sink. 1. Remove two screws D.
F F F F
F F E
2. Remove A LPF/HPF PCB and B LPF/HPF PCB. 3. Remove four screws E and eight screws F. 4. Use 2 pcs. of screw E and insert them into the two holes marked with an arrow. 5. Alternately tighten them little by little until the Heat Sink(Sub) separates from the Heat Sink.